Package On Package Assembly Inspection & Quality Control is the first text book covering every step in this exciting manufacturing and design lead technology. This book is the second publication written by Bob Willis as a free download, his first on Pin In Hole Reflow has been read by over 3000 engineers worldwide and published by SMT magazine

Package On Package Assembly Inspection & Quality Control was launched at IPC APEX Expo 2013 in cooperation with SMT magazine and available Now

Please take a look at all of our PoP Training Products & Services

The book will contain 130+ pages, 12 sections, diagrams, colour images and x-rays

Topics will include:

Package On Package Assembly Overview
Component packaging
Printed Circuit Board Design
PCB Solder Finishes
Solder Paste Printing
Automatic Optical Inspection
PoP Component Placement
Convection & Vapour Phase Reflow & Profiling
Optical & X-ray Inspection
Cleaning PoP Assemblies
PoP Underfill & Staking
Rework & Reballing Package on Packages
Conformal Coating
Reliability Testing Package On Package
POP Process Assembly Defects
PoP Technical Training Material & Services
PoP Technical Paper Bibliography


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